NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.
Do you have a background relative to packaging in the semiconductor world?
Are you able to drive innovation as a R&D Engineer?
NXP Package Innovation is a global organization responsible for the design of new packaging products and the development of new packaging technologies and assembly processes partnering with all the businesses of NXP Semiconductors to deliver the right package for each market and application.
The semiconductor market is aggressive, growing, and highly competitive. Product development cycle times are reducing, driven by user demand for faster refreshes and continuous feature upgrades. The consequence is less schedule available to support traditional design, prototyping, and qualification methods. At the same time, greater reliability is needed in end applications to keep pace with overall content growth.
NXP Package Innovation has established virtual prototyping as one key element to shorten development cycles and deliver optimized design solutions for semiconductor packaging. It allows us to make virtual experiments for devices that have never been built before. We can predict safe operating margins and on the other hand identify critical use conditions. Key requirement for virtual prototyping is an efficient and accurate simulation model that does consider multiple physical domains along with complex 3-D structures.
To reinforce our modeling and simulation team, we are looking for a mechanical engineer. He/she will develop simulation models of semiconductor components and assemblies, predict mechanical reliability, help identify technology limits and optimize packaging solutions aiming a first-time right product qualification.
Develop and execute simulation models for chip, package and assemblies, on component and system level
Guide material characterization to establish new constitutive models and reliability models
Interact with wafer Front-End / Back-End Innovation and Package Innovation teams, guide co-design of chip and package aiming first time right product qualifications.
Interact/ network with academia on mechanics, materials and simulation technology research
MS in Mechanical Engineering or equivalent is required preferably added with PhD in Mechanical Engineering,
Capability of independently performing mechanical simulations.
Thermal simulation skills (e.g. in heat conduction or CFD analysis)
Experience with FEM software ANSYS, ABACUS or MARC/Mentat and TCAD tool SENTAURUS
Experience with programing languages (e.g. Python).
Understanding of wafer fab processes and semiconductor packaging technologies
Strong written and verbal presentation skills.
If you are as excited about this opportunity as we are, we kindly invite you to apply. After a screening based on your profile, you can be expected to have a phone interview with our Talent Acquisition Consultant followed by several business interviews.