Job Properties
  • Job Type
    Full-time Position
  • Background
    Engineering
  • Languages
    English
  • Experience Required
    Entry
  • Degree Required
    Bachelor
    • Province
      Nijmegen
    • Date Posted
      October 17,2020
    • Career Consultation
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    Junior Electronic Product Package Engineer

    NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.

    NXP Semiconductor Package Innovation (PI) is an organization within the NXP Corporate Technology Office (CTO) that delivers semiconductor packaging solutions for all NXP products. We are searching for a highly motivated Electrical Engineering or similar degreed graduate to be developed into an Electronic Product Packaging Engineer. This position will be based at NXP in Nijmegen, the Netherlands.

    The position’s primary responsibility will be defining package solutions for new products in primarily substrate based ball grid array (BGA) packages, designing the most cost effective package solutions that enables a specific SoC’s IP content and then qualifying the package and assembly process solution. You will be part of a New Product Core team and be involved in NXP NPI process methodology.

    Your responsibilities will include:

    • Contributing to and when required leading cross-functional teams (Product Engineering, SoC Design, Global Quality, Manufacturing, Applications and Marketing) in the definition, development, qualification, and production launch of new NXP products.

    • Identifying and analyzing the suitability of existing and new package technology solutions as required to support new product concepts.

    • Responsible for all aspects of package design including die / package co-design, electrical requirements, layout, and documentation resulting in a best in class solution with optimized cost, manufacturability, performance and reliability. Working with business group partners and others on electrical modelling and simulation of the proposed package solution where required.

    • Effectively planning and executing projects to ensure key deliverables are met per the project technical, schedule, resource, and financial requirements.

    • Responsible for tracking and updating the project schedules, managing issues and risks, communicating project status to management, stakeholders and project teams.

    • Assisting in identifying and engaging with external material suppliers such as substrate fabricators and OSAT’s as required.

    You qualifications:

    • Bachelor’s degree in Electrical Engineering or equivalent with up to two years of relative experience is required. Master’s degree in Electrical Engineering or equivalent is preferred.

    • CAD design experience is preferred but not required.

    • Electromagnetics Theory coursework and / or experience is a plus.

    • Project Management experience preferred but not required.

    • Experience in the Semiconductor Industry preferred but not required.

    • Excellent problem-solving and interpersonal communication skills are required.

    • Strong leadership and team building skills required along with the ability to challenge decisions when needed.

    • MS Office experience required including advanced knowledge of MS Excel.

    • Verbal and written proficiency in communication in English language.

    I f you are as excited about this opportunity as we are, we kindly invite you to apply. After a screening based on your profile you can be expected to have a video interview with our Talent Acquisition Consultant followed by business interviews.

     
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