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  • Job Type
    Full-time Position
  • Background
    Other Science and Tech
  • Languages
  • Experience Required
  • Degree Required
    • Province
    • Date Posted
      October 16,2020
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    Internship: Electronic Packaging

    NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.

    Your Team:

    Within NXP, Package Innovation is the global organization responsible for the design and industrial development of new semiconductor packages and the associated new packaging technologies. Package Innovation cooperates with all the businesses lines of NXP to deliver the right package for each silicon chip, market and application.

    The project:

    The road towards autonomous vehicles is amongst the most exciting challenges for the microelectronics industry. Besides developing innovative hardware, such as perceptual systems (RADAR/LIDAR), control units (ECUs), and communication infrastructure (V2X), the functional safety is of utmost importance for its acceptance by end-users. Mechanical stress is a major concern for the reliability of in-vehicle microelectronics. Currently, comprehensive simulations are performed during the design phase to assess their robustness. These simulations are used to assess individual failure modes (e.g. solder cracks or delamination) on an ad-hoc basis. To have a full mechanical assessment of a new design, a thorough comparison with historical data is necessary. In this project we will work on this full perspective by systematically comparing simulations results with experimental data. Eventually, this will lead to datasets that can be used for machine learning of monitoring devices (e.g. digital twins) for prognostic health management.

    Your responsibilities :

    • Literature review and analysis of state-of-the art simulation techniques.

    • Plan & execute simulation activities (incl. failure modes/metric definition).

    • Work on correlation between existing experimental data and simulation models to determine failure criteria to build and calibrate a baseline model.

    What’s in it for you?

    • Gaining experience in a multinational and diverse environment.

    • Ability to develop your skills (technical, soft skills, communication, etc.).

    • Working on cutting-edge technology (e.g. autonomous driving, and IoT).

    • (Assist in) writing a contribution for an international journal/conference.

    Your profile:

    • BSC/MSC student in e.g. (mechanical) engineering, physics, or microelectronics.

    • Basic knowledge of Finite Element Analysis; practical experience is preferred.

    • Ability to work independently and to structure your own project.


    The duration of the internship will be a minimum of 6 months and will take place in NXP Nijmegen (but working from home is an option). The assignment is also suitable for Thesis.

    Please note that to be considered for this position, you need to be registered as a student during the entire period .

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