Job Properties
  • Job Type
    Full-time Position
  • Background
    Other Science and Tech
  • Languages
  • Experience Required
  • Degree Required
    • Province
    • Date Posted
      October 09,2020
    • Career Consultation
    • CV CHECK
    • internship package
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    Intern: Plasma cleaning processes improvement

    NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.

    Your Team:

    GNTC-N Sample Services support worldwide the Semiconductor Business Units with fast track IC prototyping.

    We are the experts at both Sample Services and BU Operations BE Innovation work together to launch new package samples to the BL, as soon as possible.

    We are always looking for the newest techniques and demands of our BU-partners and like to discuss on new technics and demands.

    We are Partner of BU-Operations Frontend and Backend Innovation, the experts in wafer & package-technology.

    To support our customers we have other specific services to offer as well:

    • Customer Return Packaging flow; customer returns are inspected and re-assembled

    • Assembly of Evaluation boards

    • Re-balling for BGA packages

    • Engineering support

    Our engineers are able to create/design special processes

    Job Description:

    Plasma cleaning is a method to clean surfaces of the Semiconductors Assembly samples. Not only to clean it from dirt, organics and such, but also oxides. And after a thorough cleaning it activates the surface for the next process steps in our assembly room. There is often the wire-bonding process, but also adhesive or molding process steps are improved after a plasma clean.

    As we work with lead-frames, laminates, BGA's and PCB's and in most cases there is already a chip glued on the the substrates, we will need several recipes. And each of them need to be designed, tested and analyzed.

    The mentor, an engineer working at the department, will guide you during the assignment.

    Your responsibilities:

    • Optimize the existing plasma process

    • Create new plasma processes

    • Accepted release report

    What’s in it for you

    • Experience working in the semiconductor industry

    • Experience working in a flexible and innovative department

    • Experienced working on process related research that will be used afterwards for new developments and products.

    • Opportunity to work with newly developed equipment

    • Get more insight of other Semiconductor processes

    • During the internship Laptop with the needed software is applied

    Your profile:

    • You are currently pursuing your BSc studies in Material science, Applied Physics or Engineering

    • Hand’s-on mentality

    • Team player

    • Proactive behavior and curiosity about the process

    • Good communication skills

    • Data Analysis

    • Ability to work with laboratory tools

    • Interest in experimental work

    • Knowledge of Dutch and English


    We are looking for a student who would be available to join us from February 2021. This is a full-time internship (40 hours per week) with a duration of 6 months.

    Please note that in order to be considered for an internship/working student, you need to be registered as a student during the entire period.

    If you are as excited about this opportunity as we are, then we kindly invite you apply via our external careers site.

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