NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.
Are you eager to learn more about semiconductor packaging an apply your knowledge on mechanical engineering in practice?
NXP Package Innovation is the global organization responsible for the design and industrial development of new semiconductor packages and the associated new packaging technologies. Package Innovation partners with all the businesses of NXP Semiconductors to deliver the right package for each silicon chip, market and application.
The semiconductor market is aggressive, growing, and highly competitive. Product development cycle times are reducing, driven by user demand for faster refreshes and continuous feature upgrades. As a consequence there is less time available to support traditional design, prototyping, and qualification methods. At the same time, greater reliability is needed in end applications to keep pace with overall content growth.
NXP Package Innovation has established virtual prototyping as one key element to shorten development cycles and deliver optimized design solutions for semiconductor packaging. It allows us to perform virtual experiments on devices that have never been built before. We can predict safe operating margins and on the other hand identify critical use conditions. Key requirement for virtual prototyping are efficient and accurate simulation models that do consider multiple physical domains along with complex 3-D structures.
Master Internship – Wire bond modelling
Although wire bonds have been in use for decades in the semiconductor industry finite element modelling of wire bonds is not common.
Within the project the goal is not to predict the exact wire bond and pad shape after bonding but to investigate the stress on the underlying bond pad structure during some stages of the bonding.
This internship focusses on creating a flow for wire bond simulation.
Given the nature of the process it is expected that several advanced simulation techniques are needed such as global-local/sub-modelling, mesh morphing and global remeshing.
Your responsibilities :
Literature review and analysis of state-of-the art
Getting to know the wire bond process and its parameters
Definition of a simulation flow chart and mapping out the relevant assumptions and input.
Creation of a demonstration simulation model
Documentation of the relevant techniques used in the model
What’s in it for you?
Ability to develop your skills (technical, soft skills, communication, etc.)
Gaining experience in a multinational and diverse environment
Working on the cutting edge of technology and contribute to NXP’s future objectives
Use your academic background in scientific writing of a report and potentially in a conference paper.
Master student in Mechanical Engineering, Physics or Microelectronics
Basic knowledge with FEM analysis, practical experience is a pre.
Ability to work independently and to structure your own project
Ability to communicate technical knowledge in a clear and understandable manner. (speaking and writing)
The duration of the internship will be a minimum of 6 months (20 weeks), 40h/week and will take place in NXP Nijmegen.
Please note that in order to be considered for an internship/working student position, you need to be registered as a student during the entire period .